Paper Accepted to IEEE Transactions on Industrial Electronics

Aug 1, 2021 1 min read News

The paper, “A 80x60 Micro-Bolometer CMOS Thermal Imager Integrated with a Low-Noise 12-Bit DAC,” was accepted for publication in IEEE Transactions on Industrial Electronics.

Journal: IEEE Transactions on Industrial Electronics
Journal metrics: IF 7.503

Paper IEEE TIE CMOS Imager
Byunghun Lee
Byunghun Lee
Associate Professor blee22@hanyang.ac.kr

Integrated circuits and systems for neural interfaces, wireless power and data transfer, neuromodulation, and bioelectronic systems.