A 80×60 Micro-Bolometer CMOS Thermal Imager Integrated With a Low-Noise 12-Bit DAC

K. D. Kim, S. Park, Byunghun Lee, H. M. Lee, G. H. Cho
August 2022 Journal Papers
DOI IEEE Xplore
Type
Journal article
Publication
IEEE Transactions on Industrial Electronics, vol. 69, no. 8, pp. 8604-8608

Corresponding authors: Byunghun Lee and G. H. Cho
Journal metrics: SCIE Q1, IF 7.503

CMOS Thermal Imager Micro-Bolometer Low-Noise DAC Sensor Interface Mixed-Signal IC
Byunghun Lee
Byunghun Lee
Associate Professor blee22@hanyang.ac.kr

Integrated circuits and systems for neural interfaces, wireless power and data transfer, neuromodulation, and bioelectronic systems.